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| Hall ICs DN8797SE 3 V Hall IC One-way magnetic field operation Unit: mm I Overview The DN8797SE is a 3 V operation Hall IC which includes a Hall element, amplifier circuit, Schmidt circuit, stabilized power supply and temperature compensation circuit which are integrated on a single chip with a fine patterning technology. The magnetic input signal is outputted by being converted to high or low. We have improved the conventional circuit to realize a stable operation covering from low to high supply voltage and from low to high temperature. 4.520.3 4.520.3 12.506.5 (1.0) (1.0) 0.550.15 (0.72) 0.40.1 1.27 123 (0.4) 1.540.1 I Features * Wide operating supply voltage range (VCC = 2.7 V to 16.0 V) * Wide operating ambient temperature (-40C to +85C) * Package: SIP 3-pins * Equipped with an output pull-up resistor (typical 56 k) SSIP003-P-0000C Note) The package of this product will be changed to lead-free type (SSIP003-P-0000J). See the new package dimensions section later of this datasheet. I Applications * DC brushless motor, fan motor, rotation sensor, detection of cover open/close (example for a cellular phone), position sensor 1 VCC I Block Diagram Constant voltage source 56 k (typ.) Comparator Hall element Amplifier 3 Out GND 2 Publication date: January 2002 SPC00010BEB 1 DN8797SE I Pin Descriptions Pin No. 1 2 3 Symbol VCC GND Out Description Supply voltage pin Ground pin Output pin I Absolute Maximum Ratings Parameter Supply voltage Output voltage Supply current Power dissipation Operating ambient temperature Storage temperature Symbol VCC VOUT ICC PD Topr Tstg Rating 18 18 250 -40 to +100 -55 to +125 Unit V V mA mW C C Note) 1. Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25C. 2. The reverse insertion of this IC will cause its breakdown. 3. It will operate normally in several tens of ms after power on. 4. This IC is not suitable for car electrical equipment. I Recommended Operating Range Parameter Supply voltage Symbol VCC Range 2.7 to 16.0 Unit V I Electrical Characteristics at Ta = 25C Parameter Operating magnetic flux density 1 Operating magnetic flux density 2 Hysteresis width Output voltage 1 Output voltage 2 Output voltage 3 Output voltage 4 Output short-circuit current Supply current 1 Supply current 2 Symbol BH-L BL-H BW VOL1 VOL2 VOH1 VOH2 -IOS ICC1 ICC2 VCC = 3 V VCC = 3 V VCC = 3 V VCC = 16.0 V, IO = 5 mA, B = 20 mT VCC = 2.7 V, IO = 5 mA, B = 20 mT VCC = 16.0 V, IO = -20 A, B = 3 mT VCC = 2.7 V, IO = -20 A, B = 3 mT VCC = 16.0 V, B = 3 mT, VO = 0 V VCC = 16.0 V, B = 3 mT VCC = 2.7 V, B = 3 mT Conditions Min 3 0.2 14.4 1.05 0.19 1.0 1.0 Typ 1.5 0.07 0.07 14.9 1.55 1.27 3.5 2.5 Max 20 4.0 0.30 0.30 15.4 2.05 0.39 6.0 6.0 Unit mT mT mT V V V V mA mA mA Note) 1. Symbol BH-L stands for the operating magnetic flux density where its output level varies from high to low. 2. Symbol BL-H stands for the operating magnetic flux density where its output level varies from low to high. 3. The variation of operating magnetic flux density does not depend on supply voltage due to its built-in stabilized power source. (VCC should be confined to the range of 2.7 V to 16.0 V.) 4. A supply current changes by maximum 1 mA when its output level varies from high to low. 2 SPC00010BEB DN8797SE I Technical Data * Position of a Hall element (unit in mm) Distance from a package surface to sensor part: 0.42 mm 2.26 2.13 1.75 2.26 * Magneto-electro conversion characteristics S Output voltage BL-H BW BH-L N Applied magnetic flux density B Direction of applied magnetic field I Caution on Use of Hall ICs The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix the package with adhesives or fix it on a dedicated case. 1. A case using an adhesive Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes the aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection. If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those manufacturers before using. We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive. 2. A case bending lead wire Wrong Correct Bend the lead wire without stressing the package. Wrong Wrong Correct (a) 3 mm * Fixed W W Fixed W Fixed Wrong Correct Bending method of lead wire (b) 3 mm * Bending position of lead wire *: The distance can be within 3 mm, if no stress is applied to the resin mold by tightly fixing the lead wires with a metallic mold or the like. SPC00010BEB 3 DN8797SE I Caution on Use of Hall ICs (continued) 3. Power supply line/Power transmission line If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line. In this case, set the capacitor of 0.1 F to 10 F near the Hall IC to prevent it. If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.). 4. VCC and GND Do not reverse VCC and GND. If the VCC and GND pins are reversely connected, this IC will be destroyed. If the IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become the same as a forward biased diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will flow through the IC, ending up in its destruction. (This is common to monolithic IC.) 5. Cautions on power-on of Hall IC When a Hall IC is turned on, the position of the magnet or looseness may change the output of a Hall IC, and a pulse may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the supply power is on. 6. Fixing a Hall IC When the Hall IC of an insertion type package installed by soldering the lead wire only is to be used under vibration, fix it firmly with a holder. Otherwise, vibration may cause metal fatigue in the lead wire of Hall IC, resulting in wire breakage. 7. On fixing a Hall IC to holder When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC. If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package and the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture. Sensitivity may also be changed by this stress. 8. On using flux in soldering Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the disconnection of the aluminum wiring on the surface of an IC chip. 9. In case of the magnetic field of a magnet is too strong Output may be inverted when applying a magnetic flux density of 100 mT or more. Accordingly, magnetic flux density should be used within the range of 100 mT. 10. On mounting , deburring and soldering of insertion type package If the leads of a Hall IC in an insertion type package are inserted up to their root part through holes on the printed circuit board, abnormal stress is applied to the package and the reliability of the Hall IC is likely to deteriorate. So, when mounting each Hall IC of the insertion type, insert the leads in due degree at which the bottom face of the package is separated at least 2 mm from the top face of the PCB. Also note that burrs of epoxy resin may be left sticking to the lead wires. (We are trying to remove such burrs as much as possible in the deburring process, but in some cases, they are not perfectly removable.) 2 mm When soldering the leads, remenber to separate the soldering position by 2 mm or more from the resin part of the package. Remaining burrs Printed board 4 SPC00010BEB DN8797SE I New Package Dimensions (Unit: mm) * SSIP003-P-0000J (Lead-free package) 4.520.20 1 1.27 3 0.400.10 1.27 (0.72) 0.40+0.10 -0.05 1.540.10 12.500.65 0.550.15 (1.00) (1.00) 4.520.20 SPC00010BEB 5 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR |
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